Exciting Tour of YIZUMI at CHINAPLAS 2024! – Part 1
2024-04-24
Abstract:
2024.04.23-26
NECC, Shanghai, China
Booth: 4.1D32
April 24th marks the second day of CHINAPLAS 2024, and the wonderful event continues at the NECC in Shanghai, China.
YIZUMI exhibits several innovative molding solutions under the theme of "Think Tech Forward", with a focus on three major fronts: "Intelligent and Efficient, Global Operation, and Green Development".
Now, please join us for a quick review of our advanced technologies and products, where you may learn more about the turnkey solutions you are looking for.
YIZUMI Booth
For more details about YIZUMI at CHINAPLAS, please visit our booth at D32 in Hall 4.1, or follow us on social media.
For more detailed information,
please contact:
Tel：86-757-29219001
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